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ST Sees Bright Future for Indian Electronics
India is poised to become a major player in the global electronics
manufacturing industry, with the local industry forecasted
to grow 5.5 times greater than the overall worldwide market.
In preparation, STMicroelectronics (ST) recently emphasized
the depth of support and scope of products, platforms and
technologies that it offers to customers in India. a
During last month"s "ST DAY in India" in New Delhi, senior
managers from ST presented overviews of the world and regional
electronics and semiconductor markets, with particular emphasis
on the rapidly growing Indian electronics market. Thiru Dayanidhi
Maran, minister of communication and information technology,
and Shir Jainder Singh, IT secretary, were present during
the event.
Also at the event ST unveiled what it touts as the first STB
chip entirely designed in India. The STi5107 MPEG decoder,
along with its accompanying software, was designed and implemented
at ST"s Greater Noida R&D center. The chip includes advanced
security features designed to provide a secure and low-cost
solution for the standard definition Pay-TV market.
Sarnoff"s Solution Licensed to Fujitsu
Sarnoff Europe has licensed its on-chip electrostatic discharge
(ESD) protection portfolio, TakeCharge®, to Fujitsu. Sarnoff
customized the TakeCharge solution specifically to protect
Fujitsu"s 65 nanometer complementary metal-oxide semiconductor
(CMOS) integrated circuits products from ESD damage.
TakeCharge will be Fujitsu"s primary ESD solution for its
65nm CMOS technologies after its full deployment in the company"s
related standard IO libraries.
"With more and more major companies struggling to meet industry
standard requirements such as 2kV Human Body Model and 200V
Machine Model, we"re glad Fujitsu recognized Sarnoff can offer
desired results," said Koen Verhaege, executive director
of Sarnoff Europe.
TakeCharge technology is silicon-proven in advanced processes
down to 65nm CMOS, with 45nm ESD design solutions already
in full development,
Freescale Semiconductor Acquisition
Complete
Freescale Semiconductor merged with an entity controlled by
a consortium of private equity funds including The Blackstone
Group, The Carlyle Group, Permira Advisers LLC and Texas Pacific
Group.
Under the terms of the merger adopted by Freescale"s stockholders
at a special meeting on November 13, 2006, Freescale stockholders
are entitled to receive $40 in cash for each share of Freescale
common stock that they hold.
On December 1, 2006, Freescale completed its previously announced
tender offers and consent solicitations for its outstanding
$350,000,000 aggregate principal amount of 6.875% senior notes
due 2011 and its outstanding $500,000,000 aggregate principal
amount of 7.125% senior notes due 2014, pursuant to its Offer
to Purchase and Consent Solicitation Statement, dated October
23, 2006.
Also on December 1, Freescale accepted for payment all validly
tendered notes, consisting of $349,889,000 in aggregate principal
amount of the 2011 notes, representing approximately 99.97%
of the outstanding 2011 notes, and $499,935,000 in aggregate
principal amount of the 2014 notes, representing 99.99% of
the outstanding 2014 notes.
Hubing Now in Endowed Chair at Clemson
Clemson University has named Todd H. Hubing, Ph.D., to fill
the Michelin Endowed Chair in Vehicular Electronic Systems
Integration at Clemson University International Center for
Automotive Research in Greenville, South Carolina. His faculty
appointment is in the department of electrical and computer
engineering. Prior to now Hubing was a professor of electrical
and computer engineering at the University of Missouri-Rolla.
Hubing earned his under-graduate degree from the Massachusetts
Institute of Technology and a graduate degree from Purdue
University. He completed his doctorate at North Carolina State
University in 1988. His research focuses on automotive and
aerospace electromagnetic compatibility, computational electromagnetics
and electronic device detection and identification based on
electromagnetic emissions.
"Dr. Hubing is the perfect choice for the Michelin Chair in
Vehicle Electronic Systems Integration," said Terry
Gettys, president of Michelin Americas Research and Development
Corp.
Clemson University Dean of Engineering and Science Tom Keinath
said Hubing is the perfect fit for the Clemson electrical
engineering faculty, "His career is a distinguished one, which
is rooted in a world-renowned electromagnetic compatibility
lab."
Rogall and Thiele Join EPCOS
Werner Rogall has taken over as head of EPCOS" global sales,
succeeding Monika Arntz, who left the company on September
30. He brings with him 25 years of experience in the sales
of active and passive electronic components at EPCOS and its
predecessor companies. Rogall will continue to serve as head
of business administration within sales, a position he has
held since 1988.
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| Rogall |
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Thiele |
Joining Rogall on the management team of sales is Joachim
Thiele, who has managed the DC film capacitors business unit
since 2003. Thiele started his career in 1990 in product marketing
for film capacitors at Siemens Matsu-shita Components, which
he then led from 1994.
Liao Resigns
Sirenza Microdevices, Inc. reports that Phillip Liao has resigned
as president of its PDI Segment, citing health and personal
reasons. Jerry Quinnell, Sirenza"s corporate development executive
vice president, will serve as interim president of PDI until
a replacement is named. Liao will continue to serve on Sirenza"s
board of directors.
Hengst Named President
Harris Corp. has named Ted Hengst president of Harris Technical
Services Corp. (HTSC). Hengst will report to Jeremy Wensinger,
group president, integrated systems and services, government
communi-cations systems division.
"Ted brings to Harris a wealth of experience in providing
mission support services and an under- standing of doing business
with the government," said Wensinger.
Before joining Harris, Hengst was senior vice president, Army
Solutions, at General Dynamics Corp. in Fairfax, Virginia,
where he was responsible for the division"s daily operations
and integration activities.
Prior to that he served in the U.S. Army, retiring as Colonel
in 2002. Hengst received a bachelor"s degree in engineering
from the U.S. Military Academy at West Point and a master"s
degree in management information systems from the Naval Post
Graduate School in Monterey, California. He is based at HTSC"s
headquarters in Falls Church, Virginia.
Microsemi Opens Design Center
Microsemi Corp., a leading manufacturer of high performance
analog and mixed signal integrated circuits and high reliability
semi-conductors, has opened a new design center in Taiwan
to provide closer technical support in Asia, site of its highest-growth
customer base.
The new Taipei facility will house Microsemi application and
system engineering staff, customer service, and Asia sales
management.
Opening of the center reflects the continuing growth of product
lines include backlighting, wireless LAN power amplifiers,
and DC-DC integrated circuits. The center includes a systems
engineering lab.
"We have a strong commitment to our customers in Asia that
justifies this significant investment in facilities and personnel,"
said James J. Peterson, Microsemi president and CEO.
EIA Promotes Storme Street and Rick
Goss
The Electronic Industries Alliance (EIA) has promoted Storme
Street to vice president of government relations and Rick
Goss to vice president of environment affairs.
Street will continue leading EIA"s government affairs division.
In addition to managing EIA"s overall policy portfolio, her
areas of focus will be tax and economic policy and international
businesses issues -- along with managing EIA"s competitiveness
and innovation initiative. He holds a bachelor"s degree in
journalism from the University of Missouri and is currently
an MBA candidate at George Mason University in Virginia.
Goss will continue overseeing the Environmental Issues Council,
a division of EIA and the environmental voice of the technology
industry. He earned an M.S. in environmental management and
policy from Rensselaer Polytechnic Institute and a B.A. in
political science from the University of Rochester.
Light-Sensitive Switches in Cells
UC Berkeley/Lawrence Berkeley National Laboratory Nanomedicine
Development Center is developing a method to put light-sensitive
switches in the body"s cells that can be flipped on and off,
reports NASA Tech Briefs. Optical switches like these could
trigger a chemical reaction, activate a drug, initiate a muscle
contraction, or stimulate a nerve cell.
The center is equipping cells of the retina with the photoswitches,
making blind nerve cells see, restoring light sensitivity
in people with macular degeneration. The method controls biological
nanomolecules (proteins) with light, and involves altering
an ion channel commonly found in nerve cells so that the channel
turns the cell on when it is zapped by green and off when
hit with ultraviolet light.
The researchers believe that if they can control the nanomolecules
with light, they can develop treatments for eye, skin, and
blood diseases that can be activated by light.
Flowserve Opens Center in the Netherlands
Flowserve Corp. has opened a Quick Response Center (QRC) in Moerdijk, Netherlands. The Moerdijk QRC is a fully equipped, regional sales and service center providing complete sealing solutions and localized customer support.
The new QRC offers mechanical seal manufacturing, repair, failure analysis, and inventory backup for quick response to Flowserve customers in the Netherlands and throughout northern Europe. Flowserve customers in the region will now have direct, local access to the company"s LifeCycle Advantage™ program.
"In opening our new QRC in Moerdijk, we have responded to market demand for highly localized support for our Dutch customer base," said Mark Fallek, vice president, marketing, Flowserve Flow Solutions.
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